KELVIN
Explore the full possibilities of time-saving, cost-effective product
design optimization with INTEGRATED Engineering Software’s
thermal analysis tools. KELVIN (2D/RS) and CELSIUS (3D) are the
thermal solution tools in our multiphysics set. Get the complete
electromagnetic-thermal solution of your device by combining the
electromagnetic power loss input and the thermal analysis.
High voltage bushing
temperature contours
KELVIN is a 2D/RS thermal analysis software for applications like:
- Electronic packaging
- Cooling fins
- Heat sinks
- Appliances
- Aerospace components
- Automotive components
Fast and accurate, KELVIN displays temperature, heat flux and temperature gradients using
graphs and contour, profile or arrow plots.
Our powerful parametric solvers allow designers to automatically vary and experiment with geometry, materials and
sources – reducing the tedious, repetitive task of fine–tuning multiple design parameters.
For multiphysics analysis, couple KELVIN with
OERSTED, a 2D eddy current analysis program.
- Temperature, temperature gradient and heat flux values can be displayed using
contour plots, surface representations and graphs
- Boundary conditions such as temperature, heat flux, temperature gradient,
convective and radiative heat exchange are easily assigned
- Heat sources can be assigned in the form of volume heat and surface heat
- Materials table stores thermal conductivity, specific heat and mass density
- Batch function allows for unattended solution of multiple files
- Powerful parametric feature allows definition of variable parameters to be stepped
through, allowing the analysis of multiple "what-if" scenarios and facilitating design optimization
- A wide array of post processing options for design evaluation and optimization
- Self adaptative meshing or optional user refinement
- CAD healing utilities for automatic correction of drafting errors
- Large materials library – additional materials can be easily added
- Option of custom software modification -for customers with particular needs
Cooling fins temperature
KELVIN reduces design time while improving product performance by letting you design via computer
simulations thereby reducing costs and risks associated with physical prototyping.
Easy-to-learn, KELVIN lets you focus on product development, not software training.
Two and Three Dimensional Coupled Electromagnetic/Thermal Analysis for Induction Heating Application Using the BEM
Modified Boundary Element Method for Radiative Heat Transfer Analyses in Emitting, Absorbing and Scattering Media
32 bit versus 64 bit system benchmark
Choosing a System to Use with INTEGRATED's Software
